Technical Specifications
General Information
| Type | Thermal Paste |
| Color | Gray |
| Weight | 4 g |
| Volume | 4 g (Equivalent) |
| Specific Gravity / Density | 2.60 g/cm³ |
| Thermal Conductivity | Unmentioned (Typically ranges between 3–5 W/m·K) |
Thermal & Electrical Properties
| Viscosity | 45,000 Poise |
| Continuous Use Temperature | -50°C to 150°C |
| Volume Resistivity | 1.8 × 10 Ω·cm |
| Breakdown Voltage | 7.5 kV/mm |
| Material Type | Non-Electrically Conductive Silicone-Based Compound |
| Application | Ideal for CPU, GPU, and Chipset Cooling Interfaces |
Physical Specification
| Color | Gray |
| Texture | Smooth Paste |
| Package Type | Syringe Tube (4g) |
| Ease of Application | Non-Curing, Non-Corrosive, Easy to Spread |
| Shelf Life | Long-Term Stability without Dry-Out (Typically 5+ years) |
Key Features
| High Viscosity Compound | 45,000 Poise formula ensures precise application and minimal leakage. |
| Excellent Insulation | Volume resistivity of 1.8×10 Ω·cm and breakdown voltage of 7.5 kV/mm. |
| Wide Operating Range | Performs reliably between -50°C to +150°C. |
| Safe and Non-Conductive | Eliminates risk of short-circuits during PC builds. |
| Compact 4g Tube | Suitable for multiple CPU/GPU applications. |
Warranty Information
| Warranty | No Warranty |
